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INTEGRATED CIRCUITS
DATA SHEET
TDA6106Q Video output amplifier
Product specification File under Integrated Circuits, IC02 1997 Mar 03
Philips Semiconductors
Product specification
Video output amplifier
FEATURES * No external heatsink required * Black current measurement output for Automatic Black current Stabilization (ABS) * Internal 2.5 V reference circuit * Internal protection against positive appearing CRT flashover discharges * Single supply voltage of 200 V * Simple application with a variety of colour decoders * Controlled switch-off behaviour. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDA6106Q BLOCK DIAGRAM DBS9MPF DESCRIPTION plastic DIL-bent-SIL medium power package with fin; 9 leads GENERAL DESCRIPTION
TDA6106Q
The TDA6106Q is a monolithic video output amplifier with a 6 MHz bandwidth and is contained in a 9-lead plastic DIL-bent-SIL medium power package. The device uses high-voltage DMOS technology and is intended to drive the cathode of a CRT. To obtain maximum performance, the amplifier should be used with black current control.
VERSION SOT111-1
handbook, full pagewidth
supply voltage 6
feedback output 9
n.c. n.c. n.c.
1 2 7 MIRROR 1 in out MIRROR 2 out in 8 cathode output
Vbias
1x
1x
TDA6106Q
CURRENT SOURCE 5 black current measurement output
inverting input
3
- DIFFERENTIAL + STAGE
out
out MIRROR 3
out
out
in gnd 4 ground (substrate)
MBG343
Fig.1 Block diagram.
1997 Mar 03
2
Philips Semiconductors
Product specification
Video output amplifier
PINNING SYMBOL n.c. n.c. Vin GND Iom VDD n.c. Voc Vof PIN 1 2 3 4 5 6 7 8 9 DESCRIPTION not connected not connected inverting input voltage ground, substrate black current measurement output supply voltage not connected cathode output voltage feedback output voltage
handbook, halfpage
TDA6106Q
n.c. n.c. Vin GND Iom VDD n.c. Voc Vof
1 2 3 4 5 6 7 8 9
MBG342
TDA6106Q
Fig.2 Pin configuration.
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134); voltages with respect to pin 4 (ground) unless otherwise specified; currents specified as in Fig.1. SYMBOL VDD Vin Vom Voc Vof Ioc(l) Ioc(h) Pmax Tstg Tj Vesd PARAMETER supply voltage inverting input voltage black current measurement output voltage cathode DC output voltage feedback output voltage low non-repetitive peak cathode output current high non-repetitive peak cathode output current maximum power dissipation storage temperature junction temperature electrostatic discharge note 3 note 4 Notes 1. The cathode output is protected against peak currents (caused by positive voltage peaks during high-resistance flash) of 5 A maximum with a charge content of 100 C. 2. The cathode output is also protected against peak currents (caused by positive voltage peaks during low-resistance flash) of 10 A maximum with a charge content of 100 nC. 3. Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k resistor. 4. Machine model: equivalent to discharging a 200 pF capacitor through a 0 resistor. flashover discharge = 100 C; note 1 flashover discharge = 100 nC; note 2 CONDITIONS 0 0 0 0 0 0 0 0 -55 -20 -2000 -300 MIN. 8 6 VDD VDD 5 10 tbf +150 +150 +2000 +300 MAX. 250 UNIT V V V V V A A W C C V V
1997 Mar 03
3
Philips Semiconductors
Product specification
Video output amplifier
HANDLING
TDA6106Q
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling MOS devices (see "Handling MOS Devices" ). QUALITY SPECIFICATION Quality specification "SNW-FQ-611 part E" is applicable, except for ESD Human body model see Chapter "Limiting values", and can be found in the "Quality reference handbook" (ordering number 9397 750 00192). THERMAL CHARACTERISTICS SYMBOL Rth j-a Rth j-c Note 1. External heatsink not required. CHARACTERISTICS Operating range: Tamb = -20 to +65 C; VDD = 180 to 210 V (see note 1), Vom = 1.4 to 6 V. Test conditions: Tamb = 25 C; VDD = 200 V; Vom = 4 V; CL = 10 pF (CL consists of parasitic and cathode capacitance); measured in test circuit of Fig.5; unless otherwise specified. SYMBOL IDD Ibias Vint Iom(os) PARAMETER quiescent voltage supply current input bias current (pin 3) offset current of black current measurement output temperature drift of internal reference voltage input stage linearity of current transfer CONDITIONS VocDC = 100 V VocDC = 100 V Ioc = 0 A; Vin = 1.5 to +3.5 V; Vom = 1.4 to 6 V VocDC = 100 V Ioc = -10 A to 3 mA; Vin = 1.5 to +3.5 V; Vom = 1.4 to 6 V Voc = 20 V to VDD -30 V Vin = 3.5 V Vin = 1.5 V f = 500 kHz; VocDC = 100 V VocAC = 60 V (p-p); VocDC = 100 V VocAC = 100 V (p-p); VocDC = 100 V 0 - -10 MIN. 2.8 - 2.5 0 TYP. 3.0 MAX. 3.3 20 - +10 UNIT mA A V A PARAMETER(1) thermal resistance from junction to ambient in free air thermal resistance from junction to case VALUE 56 12 UNIT K/W K/W
internal reference voltage input stage VocDC = 100 V
VTint I om ----------I oc Iof(max) Voc(min) Voc(max) GB BWS BWL
- 0.9
0.5 1.0
- 1.1
mV/K
maximum peak output current (pin 9) minimum output voltage (pin 8) maximum output voltage (pin 8) gain bandwidth product of open-loop gain Vos/Vi, dm small signal bandwidth large signal bandwidth
- - VDD - 14 - 5 4.7
25 7 VDD - 10 0.52 6 5.7
- 12 - - - -
mA V V GHz MHz MHz
1997 Mar 03
4
Philips Semiconductors
Product specification
Video output amplifier
TDA6106Q
SYMBOL tpd
PARAMETER cathode output propagation delay time 50% input to 50% output
CONDITIONS Voc = 50 to 150 V square wave; f < 1 MHz; trin = tfin = 40 ns; see Figs 3 and 4 Voc = 50 to 150 V square wave; f < 1 MHz; tfin = 40 ns; see Fig.4 38
MIN. 49
TYP.
MAX. 60
UNIT ns
tr
cathode output rise time 10% output to 90% output
62
74
87
ns
tf
cathode output fall time 90% output to Voc = 150 to 50 V square 10% output wave; f < 1 MHz; trin = 40 ns; see Fig.4 settling time 50% input to (99% < output < 101%) Voc = 50 to 150 V square wave; f < 1 MHz; trin = tfin = 40 ns; see Figs 3 and 4 Vin = 2 V (p-p) square wave; f < 1 MHz; trin = tfin = 40 ns Voc = 50 to 150 V square wave; f < 1 MHz; trin = tfin = 40 ns; see Figs 3 and 4 f < 50 kHz; note 2
62
74
87
ns
ts
-
-
350
ns
SR
slew rate between 50 and 150 V
-
1200
-
V/s
OV
cathode output voltage overshoot
-
1
-
%
PSRR Notes
power supply rejection ratio
-
60
-
dB
1. The rating of supply voltage is 250 V, but because of flash the maximum operating range for supply voltage is 210 V. 2. PSSR: The ratio of the change in supply voltage to the change in input voltage when there is no change in output voltage.
1997 Mar 03
5
Philips Semiconductors
Product specification
Video output amplifier
TDA6106Q
x Vi
0 t
x ts overshoot (in %) 150 140 149 151
Voc
100
60 50
t tr t pd
MGA974
Fig.3 Output voltage (pin 8 rising edge) as a function of AC input signal.
1997 Mar 03
6
Philips Semiconductors
Product specification
Video output amplifier
TDA6106Q
x Vi
0 t
x ts
150 140 Voc 100 overshoot (in %) 51 60 50 49 t tf t pd
MGA975
Fig.4 Output voltage (pin 8 falling edge) as a function of AC input signal.
Flashover protection The TDA6106Q incorporates a protection diode against CRT flashover discharges that clamp the cathode output voltage to a maximum of VDD + Vdiode. To limit the diode current, an external 1.5 k carbon high-voltage resistor in series with the cathode output and a 2 kV spark gap are needed (for this resistor-value, the CRT has to be connected to the main PCB). This addition produces an increase in the rise and fall times of approximately 7.5 ns and a decrease in the overshoot of approximately 1.3%.
VDD to GND must be decoupled: 1. With a capacitor larger than 20 nF with good HF behaviour (e.g. foil). This capacitor must be placed as close as possible to pins 6 and 4, but definitely within 5 mm. 2. With a capacitor larger than10 F on the picture tube base print (shared by three output stages). Switch-off behaviour The output pins of the TDA6106Q are still under the control of the input pin for a supply voltage down to approximately 30 V.
1997 Mar 03
7
Philips Semiconductors
Product specification
Video output amplifier
TEST AND APPLICATION INFORMATION
TDA6106Q
handbook, full pagewidth
Cpar Rfb C1 22 nF C2 22 F R9 866 R10 100 k 200 V
Vin
C6 100 nF
Cn 560 pF
6 R1 50 0.98 mA 3
9
TDA6106Q 8
4 5 C7 A Vom 4V 3.2 pF C8 6.8 pF C9 136 pF R3 20 M probe R2 1 M
GND
MBG344
Cpar = 150 fF.
Fig.5 Test circuit with feedback factor 1116. The dynamic dissipation equals: P dyn = V DD x ( C L + C fb + C int ) x f x V o ( p - p ) x b Where: CL = load capacitance. Cfb = feedback capacitance. Cint = internal load capacitance ( 4 pF). f = input frequency. Vo(p-p) = output voltage (peak-to-peak value). b = non-blanking duty-cycle. The IC must be mounted on the picture tube base print to minimize the load capacitance (CL).
Dissipation With respect to dissipation, distinction must be made between static dissipation (independent of frequency) and dynamic dissipation (proportional to frequency). The static dissipation of the TDA6106Q is due to supply currents and load currents in the feedback network and CRT. P stat V of = V DD x I DD + V oc x I oc - V of x ------- R fb
Where: Rfb = value of feedback resistor. Ioc = DC value of cathode current.
1997 Mar 03
8
Philips Semiconductors
Product specification
Video output amplifier
INTERNAL PIN CONFIGURATION
TDA6106Q
handbook, full pagewidth
GND 4
VDD 6
TDA6106Q
from input circuit esd esd esd from reference circuit Vbias 9 Vof
Vin
3
from input circuit esd
flash prot. from pin 9 from pin 9 esd from reference circuit 6.8 V esd flash prot. 8
Iom
5
Voc
to BCS-circuit output
MBG345
Fig.6 Internal pin configuration.
1997 Mar 03
9
Philips Semiconductors
Product specification
Video output amplifier
PACKAGE OUTLINE DBS9MPF: plastic DIL-bent-SIL medium power package with fin; 9 leads
TDA6106Q
SOT111-1
D
D1 q P P1 Q A2
A3 q1 q2
A A4 seating plane pin 1 index
E
L 1 Z b2 e b b1 wM 9
c
e2
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 18.5 17.8 A2 A3 max. 3.7 8.7 8.0 A4 b b1 b2 c D (1) D1 E (1) e e2 L 3.9 3.4 P 2.75 2.50 P1 3.4 3.2 Q q q1 4.4 4.2 q2 5.9 5.7 w 0.25 Z (1) max. 1.0
65o 55o
15.5 1.40 0.67 1.40 0.48 21.8 21.4 6.48 2.54 2.54 15.1 1.14 0.50 1.14 0.38 21.4 20.7 6.20
1.75 15.1 1.55 14.9
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT111-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-03-11
1997 Mar 03
10
Philips Semiconductors
Product specification
Video output amplifier
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA6106Q
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1997 Mar 03
11
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For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1997
Internet: http://www.semiconductors.philips.com
SCA53
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
547047/1200/01/pp12
Date of release: 1997 Mar 03
Document order number:
9397 750 01869

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